Amkor Technology
AMKRcompute· NASDAQAmkor, outsourced packaging: an OSAT that assembles and tests chips, including the advanced packaging AI accelerators depend on.
Why it matters
Advanced packaging (alongside TSMC CoWoS) is a real bottleneck for AI chips, and Amkor is a leading outsourced provider, plus the US onshoring partner for advanced-packaging capacity.
The read
Levered to Advanced-packaging capacity: alongside TSMC CoWoS, assembly and test gate how many AI accelerators actually ship.
Bull case: Advanced packaging is a gating step for AI chips, Amkor is a leading outsourced provider, and US onshoring positions it for domestic capacity.